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  SSM6P36FE 2008-06-05 1 toshiba field effect transistor silicon p channel mos type SSM6P36FE power management switches ? 1.5-v drive ? low on-resistance: r on = 3.60 (max) (@v gs = -1.5 v) r on = 2.70 (max) (@v gs = -1.8 v) r on = 1.60 (max) (@v gs = -2.8 v) r on = 1.31 (max) (@v gs = -4.5 v) absolute maximum ratings (ta = 25 c) (common to the q1, q2) characteristics symbol rating unit drain-source voltage v dss -20 v gate-source voltage v gss 8 v dc i d -330 drain current pulse i dp -660 ma drain power dissipation p d (note1) 150 mw channel temperature t ch 150 c storage temperature range t stg ?55 to 150 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/vol tage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: to ta l r a t i n g mounted on an fr4 board (25.4 mm 25.4 mm 1.6 mm, cu pad: 0.135 mm 2 6) marking equivalent circuit (top view) handling precaution when handling individual devices (which are not yet mount ed on a circuit board), ensure that the environment is protected against static electricity. o perators should wear anti-static clothing, and containers and other objects that come into direct contact with devices s hould be made of anti-static materials. usage considerations let v th be the voltage applied between gate and sour ce that causes the drain current (i d ) to below ( ? 1 ma for the SSM6P36FE). then, for normal switching operation, v gs(on) must be higher than v th, and v gs(off) must be lower than v th. this relationship can be expressed as: v gs(off) < v th < v gs(on). take this into consideration when using the device. unit: mm 0.20.05 6 1.20.05 1.60.05 1.00.05 1 2 0.50.5 3 1.60.05 5 4 0.120.05 0.550.05 jedec D jeita D toshiba 2-2n1d weight: 3.0 mg (typ.) px 6 5 4 1 2 3 q1 q2 654 123 es6 1.source1 2.gate1 3.drain2 4.source2 5.gate2 6.drain1
SSM6P36FE 2008-06-05 2 electrical characteristics (ta = 25c) (q1, q2 common) characteristics symbol test conditions min typ. max unit v (br) dss i d = -1 ma, v gs = 0 v -20 ? ? drain-source breakdown voltage v (br) dsx i d = -1 ma, v gs = 8 v -12 ? ? v drain cutoff current i dss v ds = -16 v, v gs = 0 v ? ? -10 a gate leakage current i gss v gs = 8 v, v ds = 0 v ? ? 1 a gate threshold voltage v th v ds = -3 v, i d = -1 ma -0.3 ? -1.0 v forward transfer admittance |y fs | v ds = -3 v, i d = -100ma (note2) 190 ? ? ms i d = -100ma, v gs = -4.5 v (note2) ? 0.95 1.31 i d = -80ma, v gs = -2.8 v (note2) ? 1.22 1.60 i d = -40ma, v gs = -1.8 v (note2) ? 1.80 2.70 drain-source on-resistance r ds (on) i d = -30ma, v gs = -1.5 v (note2) ? 2.23 3.60 input capacitance c iss ? 43 ? output capacitance c oss ? 10.3 ? reverse transfer capacitance c rss v ds = -10 v, v gs = 0 v, f = 1 mhz ? 6.1 ? pf total gate charge q g ? 1.2 ? gate? source charge q gs ? 0.85 ? gate? drain charge q gd v ds = -10 v, i ds = -330ma v gs = -4 v ? 0.35 ? nc turn-on time t on ? 90 ? switching time turn-off time t off v dd = -10 v, i d = -100ma v gs = 0 to -2.5 v, r g = 50 ? 200 ? ns drain-source forward voltage v dsf i d =330ma, v gs = 0 v (note2) ? 0.88 1.2 v note2: pulse test switching time test circuit (c) v out t on 90% 10% ?2.5 v 0 v 90% 10% t off t r t f v ds ( on ) v dd (b) v in v dd = ?10 v duty 1% v in : t r , t f < 5 ns (z out = 50 ) common source ta = 25c in 0 ? 2.5v 10 s v dd out r g r l (a) test circuit
SSM6P36FE 2008-06-05 3 ambient temperature ta (c) v th ? ta gate threshold voltage v th (v) -1.0 0 ? 50 0 150 -0.5 50 100 common source v ds = -3 v i d = -1 ma drain-source on-resistance r ds (on) ( ) 0 -2 -4 -6 gate-source voltage v gs (v) 0 5 r ds (on) ? v gs 4 -8 3 2 1 ? 25 c ta = 100 c 25 c i d = -100ma common source ta = 25c drain-source voltage v ds (v) i d ? v ds drain current i d (ma) 0 -200 0 -0.5 -1.0 -1.5 -100 -500 -8v common source ta = 25 c -2.8v -4.5v -1.5 v -1.8 v v gs =-1.2 v -2.5v -300 -400 -600 -700 gate-source voltage v gs (v) i d ? v gs drain current i d (ma) -1000 0 -10 -100 -0.1 -1 -0.01 -1.0 -2.0 ? 25 c ta = 100 c 25 c common source v ds = -3 v r ds (on) ? i d drain current i d (ma) drain-source on-resistance r ds (on) ( ) 0 -100 -200 0 5 4 3 2 1 v gs = -4.5 v -2.8 v common source ta = 25c -1.8 v -300 -400 -500 -600 -700 -1.5 v ambient temperature ta (c) drain-source on-resistance r ds (on) ( ) r ds (on) ? ta ? 50 0 50 150 100 common source i d = -100ma / v gs = -4.5 v -40ma / -1.8 v -80ma / -2.8 v -30ma / -1.5v 0 5 4 3 2 1
SSM6P36FE 2008-06-05 4 total gate charge qg (nc) dynamic input characteristic gate-source voltage v gs (v) 0 0 2 -4 -8 -6 -2 3 1 common source i d = -0.33 a ta = 25c v dd = - 16 v drain current i d (ma) forward transfer admittance ? y fs ? (ms) |y fs | ? i d 10 -1000 100 1000 -10 -100 300 30 -1 common source v ds = -3 v ta = 25c drain-source voltage v ds (v) c ? v ds capacitance c (pf) 1 -0.1 -1 -10 -100 10 100 30 50 3 5 common source ta = 25c f = 1 mhz v gs = 0 v c iss c rss c oss drain reverse current i dr (ma) drain-source voltage v ds (v) i dr ? v ds 1000 0 10 100 0.1 1 0.2 0.6 0.4 1.0 0.8 1.2 ? 25 c ta =100 c 25 c common source v gs = 0 v g d s i dr drain current i d (ma) switching time t (ns) t ? i d 10 -1 1000 -10 10000 -100 -1000 100 t f t on t r common source v dd = -10 v v gs = 0 to -2.5 v ta = 25 c r g = 50 t off v dd =-10v ambient temperature ta (c) p d * ? ta drain power dissipation p d * (mw) 200 0 150 120 100 140 100 150 160 250 80 60 40 20 0 -20 -40 mounted on fr4 board. (25.4mm 25.4mm 1.6mm , cu pad : 0.135 mm 2 6) *:total rating
SSM6P36FE 2008-06-05 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.


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